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Epoxide Monomers

Epoxide Monomers
Epoxide monomers are oxirane compounds with polymerizable functional groups and are important raw materials for epoxy resins.1) Epoxide resins are one of thermosetting resins, which are used in adhesives, paints, inks, and sealants, as well as in electronic materials such as printed circuit boards (PCBs), encapsulants, and display materials.2) They are also used as matrix resins for composite materials, such as carbon fiber-reinforced plastics (CFRP), and their importance has been increasing in recent years. In addition, since epoxy monomers cure through ring-opening polymerization, they exhibit low polymerization shrinkage, and active research has been conducted on their application in dental materials, where high dimensional stability is required.3)
In recent years, the development of ultra-high-speed communication technologies compatible with 5G and 6G has increased the demand for low-dielectric-constant materials that minimize signal loss and delay.4) In addition, to achieve further miniaturization of electronic devices, higher circuit integration density and improved heat resistance to withstand thermal stress are required. There is also a growing need for low-chlorine materials to prevent circuit corrosion,5) as well as for bio-based monomers and their raw materials to contribute to a sustainable society and the realization of the SDGs.6)
For epoxide resins, not only heat resistance and mechanical strength but also various other properties such as transparency, curing speed, water resistance, weather resistance, low viscosity, and flame retardancy need to be improved depending on the application. To address these challenges, epoxy monomers with diverse molecular backbones are required.
To meet the growing needs in epoxide resin development, we are actively expanding its lineup of epoxide monomers. Currently, more than 90 products are available, including those with distinctive features such as alicyclic structures, rigid polycyclic aromatic backbones, fluorine-containing compounds, and hydrophilic monomers incorporating PEG. In addition, We offer a wide range of reagents essential for epoxide resin production, such as curing agents (amines, thiols, and acid anhydrides) and photo and thermal cationic polymerization initiators. are also available. Please see the full list of products in this product category page and our product brochure.

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Alicyclic Epoxide Monomers

Dicyclopentadiene Diepoxide
1,2:5,6-Diepoxyhexahydroindan (mixture of isomers)
DE-102 (mixture of isomers)
DE-103 (mixture of isomers)
3,4-Epoxycyclohexylmethyl 3,4-Epoxycyclohexanecarboxylate (mixture of isomers)
4-Vinyl-1-cyclohexene Diepoxide (mixture of isomers)
Limonene Dioxide (mixture of isomers)
Bis(3,4-epoxycyclohexylmethyl) Hexanedioate

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Aromatic Epoxide Monomers

Bisphenol A Diglycidyl Ether
9,9-Bis(4-glycidyloxyphenyl)fluorene
4,4'-Methylenebis(N,N-diglycidylaniline)
Resorcinol Diglycidyl Ether
2-Biphenylyl Glycidyl Ether
α-Naphthyl Glycidyl Ether

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Fluorine-containing Epoxide Monomers

1,1,1-Trifluoro-2,3-epoxypropane
3-Perfluorobutyl-1,2-epoxypropane
3-Perfluorohexyl-1,2-epoxypropane

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Hydrophilic PEG-containing Epoxide Monomers

Ethylene Glycol Diglycidyl Ether (mixture)
Polyethylene Glycol Diglycidyl Ether (n=approx. 4)
Polyethylene Glycol Diglycidyl Ether (n=approx. 9)
Polyethylene Glycol Diglycidyl Ether (n=approx. 13)
Polyethylene Glycol Diglycidyl Ether (n=approx. 22)

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References

===============================>>[SEE MORE INFORMATION] <<================================
  1. 1) Synthesis and application of epoxy resins: A review
  2. 2) A Brief Overview on Epoxies in Electronics: Properties, Applications, and Modifications
  3. 3) A review of dental composites: Challenges, chemistry aspects, filler influences, and future insights
  4. 4) Versatile Landscape of Low‑k Polyimide: Theories, Synthesis, Synergistic Properties, and Industrial Integration
  5. 5) Halogen-Free Epoxy with Enhanced Corrosion Resistance for Microelectronics Packaging via γ SN2 Nucleophilic Substitution
  6. 6) Photocurable Oil-Based Thermosets Containing Modifiers from Renewable Sources for Coating Applications

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90 Results Found
View:  List
Product Number N1216
CAS RN 6388-74-5
Purity / Analysis Method: >98.0%(GC)

Product Number O0071
CAS RN 286-20-4
Purity / Analysis Method: >98.0%(GC)

Product Number O0469
CAS RN 791-22-0
Purity / Analysis Method: >98.0%(GC)

Product Number O0637
CAS RN 5380-87-0
Purity / Analysis Method: >98.0%(GC)

Product Number P3117
CAS RN 16088-62-3
Purity / Analysis Method: >98.0%(GC)

Product Number S0517
CAS RN 20780-54-5
Purity / Analysis Method: >98.0%(GC)

Product Number T3365
CAS RN 38565-52-5
Purity / Analysis Method: >98.0%(GC)

Product Number T3429
CAS RN 359-41-1
Purity / Analysis Method: >98.0%(GC)

Product Number B2108
CAS RN 2930-05-4
Purity / Analysis Method: >97.0%(GC)

Product Number B4666
CAS RN 114205-89-9
Purity / Analysis Method: >97.0%(HPLC)

Product Number B5601
CAS RN 7144-65-2
Purity / Analysis Method: >97.0%(GC)
New

Product Number B6472
CAS RN 2212-06-8
Purity / Analysis Method: >97.0%(GC)

Product Number:   N1216 | Purity / Analysis Method:   >98.0%(GC)

Product Number:   O0071 | Purity / Analysis Method:   >98.0%(GC)

Product Number:   O0469 | Purity / Analysis Method:   >98.0%(GC)

Product Number:   O0637 | Purity / Analysis Method:   >98.0%(GC)

Product Number:   P3117 | Purity / Analysis Method:   >98.0%(GC)

Product Number:   S0517 | Purity / Analysis Method:   >98.0%(GC)

Product Number:   T3365 | Purity / Analysis Method:   >98.0%(GC)

Product Number:   T3429 | Purity / Analysis Method:   >98.0%(GC)

Product Number:   B2108 | Purity / Analysis Method:   >97.0%(GC)

Product Number:   B4666 | Purity / Analysis Method:   >97.0%(HPLC)

Product Number:   B5601 | Purity / Analysis Method:   >97.0%(GC)| New

Product Number:   B6472 | Purity / Analysis Method:   >97.0%(GC)

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