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CAS RN: 461-58-5 | Product Number: C0454
Dicyandiamide

Purity: >98.0%(T)
- Cyanoguanidine
Size | Unit Price | Philadelphia, PA | Portland, OR | Japan* | Quantity |
---|---|---|---|---|---|
25G |
$17.00
|
2 | Contact Us | ≥100 |
|
500G |
$24.00
|
28 | 1 | ≥100 |
|
* Items in stock locally ship in 1-2 business days. Items from Japan stock are able to ship from a US warehouse within 2 weeks. Please contact TCI for lead times on items not in stock. Excludes regulated items and items that ship on ice.
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Product Number | C0454 |
Purity / Analysis Method ![]() |
>98.0%(T) |
Molecular Formula / Molecular Weight | C__2H__4N__4 = 84.08 |
Physical State (20 deg.C) | Solid |
Storage Temperature ![]() |
Room Temperature (Recommended in a cool and dark place, <15°C) |
CAS RN | 461-58-5 |
Reaxys Registry Number | 605637 |
PubChem Substance ID | 87565575 |
SDBS (AIST Spectral DB) | 2049 |
Merck Index (14) | 3092 |
MDL Number | MFCD00008066 |
Appearance | White to Almost white powder to crystal |
Purity(Nonaqueous Titration) | min. 98.0 % |
Melting point | 209.0 to 213.0 °C |
Melting Point | 211 °C |
Maximum Absorption Wavelength | 218 nm |
Solubility in water | Slightly soluble |
Degree of solubility in water | 41.3 g/l 25 °C |
Solubility (soluble in) | Dimethylformamide |
Solubility (slightly sol. in) | Ethanol |
Solubility (insoluble in) | Chloroform, Ether, Benzene |
RTECS# | ME9950000 |
HS Number | 2926.20.0000 |
References
- Curing of dicyandiamide epoxy resins accelerated with substituted ureas
- The influence of composition of the dicyandiamide-asymmetric urea complex curing catalyst system on the thermal effect of the epoxy diane oligomer polymerization reaction
Documents
Safety Data Sheet (SDS)
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Specifications
C of A & Other Certificates
Sample C of A
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