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CAS RN: 461-58-5 | Product Number: C0454
Dicyandiamide
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Purity: >98.0%(T)
Synonyms:
- Cyanoguanidine
Documents:
| Size | Unit Price | Philadelphia, PA | Portland, OR | Japan* | Quantity |
|---|---|---|---|---|---|
| 25G |
$17.00
|
Contact Us | 2 | ≥100 |
|
| 500G |
$24.00
|
38 | 2 | ≥80 |
|
* Items in stock locally ship in 1-2 business days. Items from Japan stock are able to ship from a US warehouse within 2 weeks. Please contact TCI for lead times on items not in stock. Excludes regulated items and items that ship on ice.
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*TCI frequently reviews storage conditions to optimize them. Please note that the latest information on the storage temperature for the products is described on our website.
| Product Number | C0454 |
| Purity / Analysis Method | >98.0%(T) |
| Molecular Formula / Molecular Weight | C__2H__4N__4 = 84.08 |
| Physical State (20 deg.C) | Solid |
| Storage Temperature | Room Temperature (Recommended in a cool and dark place, <15°C) |
| CAS RN | 461-58-5 |
| Reaxys Registry Number | 605637 |
| PubChem Substance ID | 87565575 |
| SDBS (AIST Spectral DB) | 2049 |
| Merck Index (14) | 3092 |
| MDL Number | MFCD00008066 |
Specifications
| Appearance | White to Almost white powder to crystal |
| Purity(Nonaqueous Titration) | min. 98.0 % |
| Melting point | 209.0 to 213.0 °C |
Properties (reference)
| Melting Point | 211 °C |
| Maximum Absorption Wavelength | 218 nm |
| Solubility in water | Slightly soluble |
| Degree of solubility in water | 41.3 g/l 25 °C |
| Solubility (soluble in) | Dimethylformamide |
| Solubility (slightly sol. in) | Ethanol |
| Solubility (insoluble in) | Chloroform, Ether, Benzene |
GHS
Related Laws:
| RTECS# | ME9950000 |
Transport Information:
| HS Number | 2926.20.0000 |
Application
Thermal Cationic Polymerization Initiator
References
- Curing of dicyandiamide epoxy resins accelerated with substituted ureas
- The influence of composition of the dicyandiamide-asymmetric urea complex curing catalyst system on the thermal effect of the epoxy diane oligomer polymerization reaction
PubMed Literature
Articles/Brochures
TCIMAIL
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